Packaging Materials
In response to high-quality and diverse market needs, we offer materials such as insulating materials, materials that support high-density packaging and functional materials used in LED prodction by utilizing the polymer technology cultivated over many years in the petrochemical business.
Advanced Packaging Materials
ELPAC™ THB Series: Thick Layer Photoresists
This product can be used in the forming of wiring on a variety of circuit boards, micro bumps, flip chip bumps and boasts of excellent resolution, resistance to all kinds of plating liquid, and durability in the vacuum process. You can achieve a 100μm nega-resist with just one spin coat.
ELPAC™ WPR / FG Series: Insulating Materials
WPR series are used as spin-on photo sensitive insulation materials for re-distribution line layers and over coat layers for WL-CSP (Wafer Level Chip Scale Package) or SiP (System in Package) and for organic passivation layers for semiconductor devices. JSR proposes PFAS free type as well.
PI Series: Insulating Materials
JSR develops alkaline developable and low temperature curable polyimide photo imageable dielectric (PID) for advanced packaging integrated with metal wiring and organic layer like fan-out package. This will contribute the reduction of both process cost of customers and environmental burden.
ELPAC™ HC-G Series: Low Dielectric Resin
JSR’s HC-G Series is comprised of low-dielectric resins for CCL (Copper Clad Laminate) and IC Substrate applications. JSR’s HC-G resins feature an ultra-low Df (Dissipation factor) of ~ 0.001 and the superior metal adhesion required for high frequency applications, including: 5G Communications, High-Performance Data Center and Automotive Radar.
ELPAC™PJ Series: Cross-linkers for Low CTE
ELPAC™ PJ Series products are low-dielectric cross-linkers which through their enhanced degree of cross-linking provide the printed circuit board with a lower CTE, coefficient of thermal expansion. ELPAC™ PJ Series permits ultra-low dielectric performance with superior CTE in combination with ELPAC™ HC-G Series, low Dk/Df resins.
ELPAC™AD Series: High adhesion and heat dispersion materials
ELPAC™ AD Series have high adhesion to inorganic materials such as metals, and at the same time has high heat resistance and flexibility. It has high inorganic filler dispersion characteristics, enabling high filler concentration and low varnish viscosity, as required for heat-dissipating substrates and low CTE substrates. Substrates using this product as the main agent can also achieve low CTE due to the flexibility of the resin.
XER™ Series: NBR for electronic materials
Metal-reduced NBR for electronic materials, suitable as an adhesive layer material for FPC and as a stress relieving material for epoxy resins.