Packaging Materials
In response to high-quality and diverse market needs, we offer materials such as insulating materials, materials that support high-density packaging and functional materials used in LED prodction by utilizing the polymer technology cultivated over many years in the petrochemical business.
Advanced Packaging Materials
Low Dielectric Resin ELPAC™ HC-G Series
JSR’s HC-G Series is comprised of low-dielectric resins for CCL (Copper Clad Laminate) and IC Substrate applications. JSR’s HC-G resins feature an ultra-low Df (Dissipation factor) of ~ 0.001 and the superior metal adhesion required for high frequency applications, including: 5G Communications, High-Performance Data Center and Automotive Radar.
Thick Layer Photoresists ELPAC™ THB Series
This product can be used in the forming of wiring on a variety of circuit boards, micro bumps, flip chip bumps and boasts of excellent resolution, resistance to all kinds of plating liquid, and durability in the vacuum process. You can achieve a 100μm nega-resist with just one spin coat.
NBR for electronic materials XER™ Series
Metal-reduced NBR for electronic materials, suitable as an adhesive layer material for FPC and as a stress relieving material for epoxy resins.
Insulating Materials ELPAC™ WPR Series
WPR series are used as spin-on photo sensitive insulation materials for re-distribution line layers and over coat layers for WL-CSP (Wafer Level Chip Scale Package) or SiP (System in Package) and for organic passivation layers for semiconductor devices.