JSR Corporation (Headquarters: Minato-ku, Tokyo; CEO and President: Eric Johnson; hereinafter "JSR") has recently received "The 20th JPCA Award" for its Low Dielectric Resin “ELPAC™ HC-G Series from the Japan Printed Circuit Association (Hereafter, "JPCA").

This product has not only low dielectric properties, but also has good adhesion, heat resistance, thermosetting, and reliability. The award was given in recognition of its expected contribution to the industry as a raw material for CCL for high-speed transmission and IC substrates.

The award ceremony will be held at JPCA Show 2024 (Venue: Tokyo Big Sight) on Wednesday, June 12 at 16:45. During the exhibition, we will exhibit advanced packaging materials such as "ELPAC™ HC-G Series" which won this year's award, and "MOLTIGHT IMB™" an interfacial molecular bonding material that won the award last year, at our booth (East Hall 5, Booth Number 5F-48).

We will promptly develop and provide solutions by utilizing our proprietary material design and manufacturing know-how, as well as by incorporating open innovation.