Packaging Materials
Leveraging polymer technologies cultivated over many years in the petrochemical business, JSR meets diverse high-quality market needs with materials such as dielectric materials used in semiconductor manufacturing and materials for high-density integration.
Advanced Packaging Materials
CG-7000 Series : Low Dielectric Resin
CG-7000 Series are low-dielectric resins for CCL (Copper Clad Laminate) and IC Substrate. It is an organic material with low Df value of 0.001 and good adhesion to conductive metal (Cu), making it ideal as a substrate material for high frequency applications including 5G Communication, High speed Data center and Radar.
CG-6000 Series : Cross-linkers for Low CTE
CG-6000 Series products are low-dielectric cross-linkers which through their enhanced degree of cross-linking provide the printed circuit board with a lower CTE, coefficient of thermal expansion. CG-6000 Series permits ultra-low dielectric performance with superior CTE in combination with CG-7000 Series, low Dk/Df resins.
Thick Layer Plating Photoresists
JSR’s thick layer plating photoresists offer excellent resolution, resistance to various plating solutions, and robustness for vacuum processes, and can be used for flip-chip bump formation, micro-bump formation, and redistribution layer (RDL) formation of semiconductor packages. With a single spin-coating, the negative-tone resist achieves a film thickness of 100 µm.
Photo-Imageable Dielectric Materials
JSR’s materials are suitable for the redistribution layers and photo-imageable dielectrics used in WL-CSP (wafer-level chip-size packages) and SiP (system-in-package), as well as for organic passivation materials for semiconductor devices. We also offer PFAS-free products in response to growing societal concerns in recent years.
In addition, as a photo-imageable insulating film for redistribution layers targeted at packages that integrate resin and metal wiring, such as fan-out packages, we are developing a low-temperature-curable polyimide that can use alkaline developers, enabling lower process cost and reduced environmental impact.