Packaging Materials
In response to high-quality and diverse market needs, we offer materials such as insulating materials, materials that support high-density packaging and functional materials used in LED prodction by utilizing the polymer technology cultivated over many years in the petrochemical business.
Advanced Packaging Materials
CG-7000 Series : Low Dielectric Resin
CG-7000 Series are low-dielectric resins for CCL (Copper Clad Laminate) and IC Substrate. It is an organic material with low Df value of 0.001 and good adhesion to conductive metal (Cu), making it ideal as a substrate material for high frequency applications including 5G Communication, High speed Data center and Radar.
CG-6000 Series : Cross-linkers for Low CTE
CG-6000 Series products are low-dielectric cross-linkers which through their enhanced degree of cross-linking provide the printed circuit board with a lower CTE, coefficient of thermal expansion. CG-6000 Series permits ultra-low dielectric performance with superior CTE in combination with CG-7000 Series, low Dk/Df resins.
ELPAC™ THB Series: Thick Layer Photoresists
This product can be used in the forming of wiring on a variety of circuit boards, micro bumps, flip chip bumps and boasts of excellent resolution, resistance to all kinds of plating liquid, and durability in the vacuum process. You can achieve a 100μm nega-resist with just one spin coat.
ELPAC™ WPR / FG Series: Insulating Materials
WPR series are used as spin-on photo sensitive insulation materials for re-distribution line layers and over coat layers for WL-CSP (Wafer Level Chip Scale Package) or SiP (System in Package) and for organic passivation layers for semiconductor devices. JSR proposes PFAS free type as well.
PI Series: Insulating Materials
JSR develops alkaline developable and low temperature curable polyimide photo imageable dielectric (PID) for advanced packaging integrated with metal wiring and organic layer like fan-out package. This will contribute the reduction of both process cost of customers and environmental burden.