Packaging Materials
In response to high-quality and diverse market needs, we offer materials such as insulating materials, materials that support high-density packaging and functional materials used in LED prodction by utilizing the polymer technology cultivated over many years in the petrochemical business.
Advanced Packaging Materials
ELPAC™ THB Series: Thick Layer Photoresists
This product can be used in the forming of wiring on a variety of circuit boards, micro bumps, flip chip bumps and boasts of excellent resolution, resistance to all kinds of plating liquid, and durability in the vacuum process. You can achieve a 100μm nega-resist with just one spin coat.
ELPAC™ WPR / FG Series: Insulating Materials
WPR series are used as spin-on photo sensitive insulation materials for re-distribution line layers and over coat layers for WL-CSP (Wafer Level Chip Scale Package) or SiP (System in Package) and for organic passivation layers for semiconductor devices. JSR proposes PFAS free type as well.
PI Series: Insulating Materials
JSR develops alkaline developable and low temperature curable polyimide photo imageable dielectric (PID) for advanced packaging integrated with metal wiring and organic layer like fan-out package. This will contribute the reduction of both process cost of customers and environmental burden.