JSR at SEMICON JAPAN 2024

11/22/2024

Corporate

JSR Corporation will be participating in SEMCON JAPAN 2024, starting from Wednesday, December 11th to Friday, December 13, 2024 at Tokyo Big Sight.

Join us at the following exhibits.

■Exhibit Highlights: The latest products in lithography materials, process materials, and packaging materials will be introduced.

　-In particular, in photoresists, we will introduce our cutting-edge products such as Metal Oxide Resist (MOR) as well as our efforts in PFAS-free resists.
　-In the area of process materials, we will introduce CMP slurries, CMP cleaning solutions, and in the area of advanced packaging materials, we will introduce our ELPAC™ HC-G Series of low dielectric resin, which have been well received as superior metal adhesion required for high frequency applications.
　-We will also introduce new next-generation technology products such as industry-academia collaboration initiatives, flat lenses and MRAM materials.
　-In addition to the business introduction booth, we also have booths at the Quantum Computing Pavilion and MIRAI COLLEGE.

■Exhibit Booth List

　1.Introduction of advanced materials for semiconductor manufacturing
　　East Hall 4, Booth Number 5020：Business Introduction Booth

　　*Click here to view the exhibit panels.
　　・Corporate Profile

　　・CMP Slurry
　　・CMP Slurry and pCMP Clean
　　・Advanced Wet Chemical
　　・ELPAC™ THB™ Series Thick Layer Photoresist for Plating
　　・ELPAC™ PID Series Photo-imageable Dielectric(PID)
　　・ELPAC™ HC-G/PJ/AD series for PCB
　　・ALD/CVD Precursors
　　・ArF Photoresist
　　・PFAS Free Photoresist
　　・EUV Photoresist
　　・New Innovative Activities on Semiconductor Area
　　・MRAM Materials
　　・Flat Lens
　　・i-Line Photoresist
　　・KrF Photoresist
　　・Multi-layer Hardmask