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For Cu integration at 65nm or beyond in IC manufacturing, soft CMP polishing is an important technology to prevent damage of fragile film stack and structure with low-k dielectric materials during CMP process. While conventional approaches to defect and damage reduction involve using lower polish pressures, lower polish speeds and slurry filtration to control particle-size distribution, more fundamental changes in CMP consumables may be necessary to provide solutions for the 65nm node and beyond. To meet these more stringent defect and damage requirements, JSR has developed a low-defectivity CMP process through engineering of a soft abrasive slurry and a polymer-based solid pad technologies. This paper will present some of the advances in copper and barrier polish through design of CMP consumables and their sets. Data will be shown that the compressible nature of the abrasive and soft top layer of the solid pad enable low-defect polishing while maintaining high removal rates for each substrates and planarization capability.

Quantitative Evaluation of Scratch Resistance of Organic-Inorganic Hybrid Hard Coatings

Noriyasu Shinohara, Jirou Ueda, Yoshikazu Yamaguchi, Isao Nishiwaki, Takayoshi Tanabe

Acrylic functionalized colloidal-silica dispersed UV curable organic-inorganic hybrid hard coatings are unique technology because of their excellent scratch resistance and good optical transparency in addition to the fast curing. Scratch resistance has been evaluated by pencil hardness test or steel wool scratch test. Those methods, however, are not suitable for quantitative evaluation. In this paper, Variable Load Scratching method was found to be useful for quantitative evaluation of scratch resistance. The scratch resistance was evaluated quantitatively by measuring a critical normal load. Organic-inorganic hybrid hard coatings showed higher critical normal load than conventional organic hard coatings.

Analysis of Surface and Interface of Polymer Films by NEXAFS

Tetsuo Tominaga, Hikaru Sugita, Yoshihisa Oota, Masayuki Kimura, Shin-ichi Kimura, Hidetoshi Namba

NEXAFS (Near Edge X-ray Absorption Fine Structure) spectroscopy is applied to the analysis of surface and interface of polymer films in information and electronics industries. Since a control of the surface is important for these polymer films, advanced methods for the analysis of polymer surface are necessary. An analysis of molecular orientation by NEXAFS provides a lot of useful information to polymers that the molecular orientation is important like alignment films. NEXAFS is also suitable to analyze the photo and thermal reaction of polymer films because the spectrum reveals much information related to the chemical structure of polymers as shown here. NEXAFS spectroscopy is demonstrated to be a useful method of the analysis of surface and interface of polymer films.

Structure and Mechanical Properties of Olefinic Thermoplastic Vulcanizates

Kentarou Kanae, Minoru Maeda, Hideo Nakanishi, Miki Furuta, Akihiko Morikawa

Thermoplastic vulcanizates is a special class of thermoplastic elastomer, produced by melt-mixing and crosslinking of EPDM with polypropylene simultaneously. Recently, TPV has been widely used in many industrial applications especially for the environmental reasons, such as, recyclability, processing ease compared with vulcanized rubber, and PVC replacement. The significance of the understanding of the structureproperty relationship of TPV is increasing. We have been investigated the correlation between the degree of crosslinking and particle size/distribution of EPDM phase and the resulting TPV compounds performances. Compression set properties, representing the rubber elasticity of the TPV compounds, and mechanical properties were improved with increasing crosslinking density of EPDM phase. By TEM image analysis, TPVs with smaller particle size and particle size distribution showed better physical properties and rubber elasticity.

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