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JSR Technical Review

JSR TECHNICAL REVIEW No.124(2017/03)
  1. -Photo-Patternable Adhesive for Wafer-Scale Microfluidic devices-
  2. -Development of New Photosensitive Low CTE Materials-
  3. -Development of liquid photoresist for IMS (Injection Molded Solder) with high thermal stability-
  4. -Next generation Protein A chromatography resin for antibody purification Amsphere™ A3-
  5. -ExoCap™ Exosome Isolation and Enrichment Kits-
JSR TECHNICAL REVIEW No.123(2016/03)
  1. -Fabrication of Quaternary Ammonium Chloride-functionalized Poly(hydroxyurethane)Films-
  2. -Reliability of Amorphous IGZO Thin Film Transistor with Low Water-Absorbency Passivation Layer-
  3. -Investigation of Cure Behavior of UV Curable Coatings for Optical Fiber by UV-LED lamps-
  4. -Development of High Performance Polymer Materials for the Next Generation using Large Scale Coarse-grained Molecular Dynamics Simulation-
  5. -FABRIAL™, new filaments for FFF-type3D-printer-
  6. -HUSHLLOY™~ Anti-squeak material based on ABS resin~-
JSR TECHNICAL REVIEW No.122(2015/03)
  1. -Phosgene-Free Synthesis of Polymethionine Oxides and their Application to Antifouling Polymer against Proteins and Cells-
  2. -Development of Fine pitch Negative Tone Resist for Electro-Plating-
  3. -Development of high performance heat resistant transparent polyimides based on trans-1,2,3,4-cyclopentanetetracarboxylic dianhydride-
  4. -Application of Hollow Particles to Optical Materials-
  5. -Flat Prismatic Can Type Lithium Ion Capacitors-
JSR TECHNICAL REVIEW No.121(2014/03)
  1. -Synthesis and Polymerization of Monomers Carrying Isothiocyanate Moiety and Their Application to Functional Polymers Synthesis Based on Its Reaction Selectivity-
  2. -Water-Based Binder for LIB Application-
  3. -Photo-Patternable and Adhesive Polymer for Wafer-Scale Microfluidic Device Fabrication-
  4. -Structural Analysis of Hydrocarbon Proton Conductive Membranes for Fuel Cell-
  5. -High Water Resistant Waterborne Pressure Sensitive Adhesive : AQUATRAN™-
  6. -Anti Bio Fouling Polymer:Blockmaster™-
JSR TECHNICAL REVIEW No.120(2013/03)
  1. -Development of Polycarbosilane-Derived Novel Gel Electrolytes for Lithium Ion Batteries-
  2. -Development of EUVL Material and Process for 16 nm Half Pitch-
  3. -New Desiccant Materials for OLED Application-
  4. -Development of the Latent Heat Material「CALGRIP® 」for Temperature Management Transportation-
  5. -Waterborne Highly Durable Stain Resistant Resin for Paint : SIFCLEAR®-
  6. -Photo Molding System Amolsys®-
JSR TECHNICAL REVIEW No.119(2012/03)
  1. -Novel Protein A Resin: Synthetic Polymer Matrix Design Impact on Antibody Binding Capacity-
  2. -Application of Self-Assembly Materials to Semiconductor Patterning-
  3. -XPS Analysis of Surface of Polymer Films Utilizing Chemical Modification-
  4. -Development of New Corner Molding JSR EXCELINK TPV for Automotive Weather Seals-
  5. -Biomass plastic based on poly lactic acid(PLA):BIOLLOY-
JSR TECHNICAL REVIEW No.118(2011/03)
  1. -Synthesis of Networked Polymers by Novel Epoxide Having a Lithium Sulfonate Salt Structure-Poly(ethylene Glycol)-Based Difunctional Epoxide Copolymerization and their Property -
  2. -Development of EUV Resist for 22nm Half Pitch and beyond-
  3. -Development and Industrialization of Novel Alignment Films with Steroidal Structure for Liquid Crystal Display Televisions-
  4. -CMP Slurry for Cu/Porous Low-k Integration-
  5. -Functional film and sheet VALUETECH®-
  6. -Transparent Conductive Films "ELARTR"Series-
JSR TECHNICAL REVIEW No.117(2010/03)
  1. -Phosgene-free Synthesis of α -Amino Acid N-Carboxyanhydride(NCA)by Using Diphenylcarbonate-
  2. -Analysis of Surface and Interface of Homeotropic Alignment Films by NEXAFS-
  3. -Improved Silica Dispersibility with Functionalized S-SBR for Lower Rolling Resistance-
  4. -Characterizations of vinyl ether UV-cure nanoimprint resist-
  5. -Coatings for Anti-reflection“OPSTARR”-
  6. -3-D Micro Photo Fabrication System ACCULAS-
JSR TECHNICAL REVIEW No.116(2009/03)
  1. -Development of Aromatic Polymer Electrolyte Membrane with High Conductivity and Durability for Fuel Cell-
  2. -Aggregation Behavior of New Cyclic Saturated Copolymers Synthesized via Ring-opening Methathesis Polymerization-
  3. -Characteristics of a Structural Color of Hollow Particles-
  4. -Double Patterning Materials for Sub-40nm Application-
  5. -Materials for CMOS / CCD Image Sensors-
  6. -Lithium-Ion Capacitors-
JSR TECHNICAL REVIEW No.115(2008/03)
  1. -Properties of Hydrogenated Polystyrene-blockpoly( styrene-co-butadiene)-block-polystyrene(SSEBS)and its Miscibility in the Blends with Polypropylene-
  2. -Advanced CMP Consumables for 32nm Generation-
  3. -High Reliability Alignment Material for Active Matrix LCD Fabricated by Low Temperature Bake Processes-
  4. -Development of Magnetic Particles for Biomolecule Separation-
  5. -RB Sponge Sole by Injection Molding-
  6. -Topcoat Material for ArF Immersion-
JSR TECHNICAL REVIEW No.114(2007/03)
  1. -Modified Solution SBR for the Next Generation-
  2. -Performance Comparison of Chemically Amplified Resists under EUV, EB and KrF Exposure-
  3. -Solution-Processed Silicon Films and Transistors-
  4. -The Effect of the Fiber Temperature During Fiber Drawing on the Properties of Primary Coatings-
  5. -High Performance Negative Electrode Binder of Lithium Ion Battery-
  6. -Alignment Film for VA-LCD-
JSR TECHNICAL REVIEW No.113(2006/03)
  1. -Development of Novel High-refractive-index Fluid for the Next Generation ArF Immersion Lithography-
  2. -Photosensitive Column Spacer Materials for Liquid Crystal Display Panels-
  3. -Toughness Improvement of Epoxy Resins for Photofabrication-
  4. -Influence of Diffused Light on Visual Perception of Print Gloss in Coated Paper-
  5. -Photocatalytic Coating Material(DYNACERA)-
  6. -Magnetic Beads for Diagnostics Use-
JSR TECHNICAL REVIEW No.112(2005/03)
  1. -Advanced CMP Consumables with Low Defectivity-
  2. -Quantitative Evaluation of Scratch Resistance of Organic-Inorganic Hybrid Hard Coatings-
  3. -Analysis of Surface and Interface of Polymer Films by NEXAFS-
  4. -Structure and Mechanical Properties of Olefinic Thermoplastic Vulcanizates-
  5. -Photoresist for ArF Lithographyg-
  6. -Dielectric Layer Dryfilm for PDP-
JSR TECHNICAL REVIEW No.111(2004/03)
  1. -Spin-on-glass (SOG) for Tri-layer Imaging Process-
  2. -Single-mode Optical Fiber Interconnection by using Self-Written Waveguides-
  3. -A General Method to Induce Durable Liquid-Crystal Pretilt Angle on Photo-Alignment Films-
  4. -Application of a New Evaluation Method of Sheet Appearance to Various Coated Papers-
  5. -Thick Layer Resist for Solder Bumping-
  6. -The Innovative Low Modulus Styrenic Materials for Automobile-Techno αBS-
JSR TECHNICAL REVIEW No.110(2003/03)
  1. -High Sensitive Pigment-Dispersed Color Resist for LCD Color Filter-
  2. -Development of SSQ Based 157nm Photoresist-
  3. -Photolithographic Properties of Photosensitive Sol-Gel Materials and Their Application to Optical Waveguides-
  4. -Compatibility and Properties in the Blends of Polypropylene with Hydrogenated Polystyrene-block-polybutadiene-block-polystyrene(SEBS), and Application for Compatibilizer-
  5. -Advanced ARTON Thin Film for Retarder-
  6. -Specialty Olefinic Thermoplastic Elastomer -EXCELINK- PartⅡ-
JSR TECHNICAL REVIEW No.109(2002/03)
  1. -Soluble Mainchain Polyoxadiazoles as Electron Transport Materials-
  2. -Effect of Film Thickness on Electrical Properties of Polyimide Thin Films-
  3. -193 SLR System based on COMA-Acryl hybrid system-
  4. -Inorganic Compounds as Coatings on Polymer Particles and as Hollow Spheres-
  5. -Specialty Olefinic Thermoplastic Elastomer -JSR EXCELINK- -
  6. -JSR CMP Pad-
JSR TECHNICAL REVIEW No.108(2001/03)
  1. -Dynamic density functional study of the phase separated structures of thin polymer blend film-
  2. -Pulsed Laser-Induced Liquid Crystal Alignment Parallel to the Exposure Polarization-
  3. -Design and lithographic performances of 193-specific photoacid generators-
  4. -Development and Commercialization of Hydrogenated Ring-opening Metathesis Polymers-
  5. -Wafer Level Testing(WLT)-PCR enables batch processing of all bumps contact during Wafer Level Burn-in.-
  6. -Elastomer-like Resin for Stereolithograply -DesoliteRSCR330--
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Research and Development