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Electronic Materials

The electronic materials business: By utilizing the polymer technologies acquired over the years in the petrochemicals business, JSR has developed materials for use in semiconductor manufacturing. In response to high-quality and diverse market needs, JSR offers materials such as photoresists for circuit formation, chemical mechanical planarization (CMP) materials and insulating materials which are indispensable in the process of multi-layer wiring configurations in semiconductor production, and materials that support high-density packaging.


Lithography Materials

PhotoresistsCatalogue(PDF 414KB) / Catalogue(PDF 452KB)

JSR's full product line for imaging super critical features includes 248 and 193nm positive and negative tone photoresists, and g-line and i-line resists for critical and non-critical applications. JSR also provides a full array of related materials, including spin-on hardmask materials for advanced technologies.

Top Coat Materials for Immersion Lithography

This material prevents liquids such as water used in immersion lithography from penetrating into the photoresists, and at the same time can play a role in preventing a sublime substance produced by photoresist materials from exerting a damaging influence on the high quality lens surface of the exposure tool.

Multilayer Hardmask MaterialsCatalogue(PDF 594B)

JSR develops organic and inorganic spin-on hardmask materials by utilizing its proprietary technologies.

Next Generation Lithography MaterialsCatalogue(534KB)

JSR develops various lithography materials such as EUV photoresists for next generation semiconductor manufacturing process for 16nm node and beyond.

Directed Self-Assembly Materials (DSA)Catalogue(438KB)

This material forms even more minute patterns and is made with mix of propriety JSR double polymers, which were phase separated and then shrunk.

Process Materials

Interconnect Materials, Spin-on Low-k Materials Catalogue(PDF 259KB)

JSR offers interconnect materials such as the low-temperature curable spin-on gapfill material with narrow gap filling capability and Ru CVD precursors. In addition to this Ru CVD precursorJSR also provides interconnect materials in the general interconnect category.

CMP SlurryCatalogue(PDF 422KB)

This is a CMP slurry (Chemical Mechanical Planarization) necessary for the production of high performance LSI manufacturing.

CMP PadCatalogue(PDF 392KB)

This is a CMP pad (Chemical Mechanical Planarization) necessary for the production of high performance LSI manufacturing. Thanks to its use of WSP (water soluble particles), it polishes evenly without damaging the surface.

Device Integration Materials

Extremely Bright Material for LEDs LUMILON® Series

This type contains four product series: inorganic paintable dialectric material LUMILON® SC Series which is used in the manufacturing of LED elements; LUMILON®GF Series for gap filling; the same material which is capable of patterning with exposure to light, LUMILON® DE Series; and the photoresist material made for the lift-off of electrode formation, LUMILON® LP Series.

Thick-film Processing Photoresists ELPAC™ THB SeriesCatalogue(PDF 508KB)

This product can be used in the forming of wiring on a variety of circuit boards, micro pumps, flip chip pumps and boasts of excellent resolution, resistance to all kinds of plating liquid, and durability in the vacuum process. You can achieve a 80μm nega-resist with just one spin coat.

Photosensitive Insulating Materials ELPAC™ WPR SeriesCatalogue(PDF 337KB)

WPR series are used as spin-on photo sensitive insulation materials for re-distribution line layers and over coat layers for WL-CSP (Wafer Level Chip Scale Package) or SiP (System in Package) and for organic passivation layers for semiconductor devices.

Materials for 3D Integration

JSR provides Flux Materials in addition to temporary bonding material and photosensitive adhesive.

Contact Us
Electronic Materials Div.
Lithography Materials Dept.
Headquarters
1-9-2, Higashi-Shinbashi, Minato-ku, Tokyo 105-8640, Japan
TEL: 81-3-6218-3561 FAX: 81-3-6218-3690

Kyushu Office
1580-1 Kamiizumi, Kuboizumi-cho, Saga, 849-0902, Japan
TEL: 81-952-98-1911 FAX: 81-952-98-0911
<Products>
  • Lithography Materials
Electronic Materials Div.
Advanced Electronic Materials Dept.
Headquarters
1-9-2, Higashi-Shinbashi, Minato-ku, Tokyo 105-8640, Japan
TEL: 81-3-6218-3562(Process Materials)
TEL: 81-3-6218-3563(Advanced Electronic Materials)
FAX: 81-3-6218-3690

Kyushu Office
1580-1 Kamiizumi, Kuboizumi-cho, Saga, 849-0902, Japan
TEL: 81-952-98-1911 FAX: 81-952-98-0911
<Products>
  • Process Materials
  • Device Integration Materials
Taiwan Office
17F-C1, No.8, Zichiang S. Rd., Jhubei City, Hsinchu County 302, Taiwan, R.O.C.
TEL: 886-3-657-6600 FAX: 886-3-657-6642
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
JSR Electronic Materials Korea Co., Ltd.
#A610 Samwhan HIPEX 240, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do
TEL: 82-31-698-4420 FAX: 82-031-698-4421
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
JSR(Shanghai)
Rm 606 SMEG PLAZA 1380 Hongqiao Road, Shanghai 200051
TEL: 86-21-6278-7600 FAX: 86-21-6278-7604
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
Singapore Office
20 Science Park Road, #01-03A Teletech Park. Singapore 117674
TEL: 86-21-62TEL: 65-6775-0031 FAX: 65-6775-0072
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
JSR Micro, Inc.
1280 North Mathilda Avenue Sunnyvale, CA 94089
TEL: 408-543-8800 FAX: 408-543-8999
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
JSR Micro N.V.
Technologielaan8, B-3001 Leuven BELGIUM
TEL: 32-16-832-832 FAX: 32-16-832-839
<Products>
  • Lithography Materials
  • Process Materials
  • Device Integration Materials
Product Information