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JSR and IBM Collaborate to Provide Cost-Effective Semiconductor Materials Solutions for 32nm and 22nm Technology Nodes

R&D  02/19/2009
SUNNYVALE, Calif. - February 19, 2009 -JSR Corporation, along with its US operations, JSR Micro, Inc, announced today that it has entered into several joint development partnerships with IBM to develop new materials and processes for 32nm and 22nm nodes of semiconductor technology.

The new agreement with IBM will focus on next generation advancements for materials JSR has had in development and commercial production, including low-k dielectric (LKD) solutions and a broad range of 32nm and 22nm photoresist systems.

"This larger scale collaboration is a huge complement to the joint research and development JSR Micro is already doing with IBM in photoresist," said JSR Micro, Inc. President Eric Johnson. "JSR has been making extensive progress in non-resist related areas and the partnership with IBM, we feel, is a real validation of that work."

The companies are working to pave the way for the adoption of three novel low-k dielectric technologies including new CVD low-k materials, novel photo-patternable low-k (PPLK) dielectric materials, and ultra-low-k (k=2.0) dielectric materials, all developed jointly by IBM Research and JSR Corporation.

The CVD low-k materials are based on a novel molecular structure inspired in part by the spin-on ULK work offering k=2.2 with reduced sidewall plasma damage, better trench bottom roughness and better CD control over the process of record CVD low-k material.

The PPLK material concept, invented by IBM, combines the functions of a photoresist and a dielectric insulator into one single material, eliminating the need for several sacrificial materials and their related plasma etching steps. This new approach offers significant cost savings and dramatic reduction in process complexity. IBM and JSR are also exploring extending the PPLK concept to new materials that are capable of "printing" finer interconnect features. This new material technology is also a major step toward greener semiconductor manufacturing.

The ultra-low-k material, originally studied by IBM and now under joint development with JSR, is a spin-on dielectric offering k=2.0 with extraordinary modulus, toughness to CMP, and the ability to enable the extension of the conventional build of BEOL structures to the extreme low k regime.

"The collaboration between JSR and IBM during the low-k JDAs has produced tremendous results with exciting applications for both companies." said Robert Wisnieff, IBM Manager of Interconnect Technology.

IBM and JSR have previously collaborated in the area of advanced ArF photoresist development, which yielded solutions that have been implemented within IBM and the semiconductor industry as a whole. The companies' new joint projects include double patterning advancements and other lithography material challenges for future technology nodes.

"Through our joint collaboration in the area of ArF photoresists we have been able to address major areas of concern within lithography," said IBM Senior Technical Staff Member Dr. Rao Varanasi. "Additionally, this joint work is acting as the foundation to help advance our leading edge materials solutions targeting the 22nm node and beyond."

Details of the PPLK technology will be presented in invited papers at the upcoming MRS and SPIE Advanced Lithography shows in 2009. The papers are authored by Qinghuang Lin, AlshakimNelson, Philip Brock, Stephen A. Cohen, Blake Davis, Jeffrey Gambino, Eric Liniger, Deborah Neumayer, Yuri Ostrovski, Jyotica Patel, Eva Simonyi, Ratnam Sooriyakumaran, Sampath Purushothaman, Robert Miller, Bob Allen, Robert Wisnieff, and are, respectively:

* Photo-Patternable Low-k Dielectrics: Greener Materials for Semiconductor Manufacturing
* Integrating Photo-Patternable Low-k Materials into Advanced Semiconductor Cu BEOL


About JSR Corporation
Tokyo based JSR Corporation is an advanced manufacturer in high-polymer chemistry, it operates a wide range of global businesses ranging from the petrochemical business, including the manufacture of synthetic rubber, to the cutting-edge information processing and electronic materials business, including the manufacture of semiconductor materials and liquid crystal display materials.

About IBM
For more information about IBM, please visit www.ibm.com.